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AOI Systems SAKI 3Di-LS2 18um
ingeniería de procesos / máquinas e instalaciones para la ingeniería de procesos
Fabricante: SAKI
Modelo:3Di-LS2 18um
Tipo de máquina: AOI Systems
Número de artículo: 170120013
Cantidad: 1
Fecha: 31.08.2026
Año de fabricación: 2023
Ubicación: Stuttgart, Germany
Precio:
Seller-item-No.:9456929
Manufacturer: SAKI
Model: 3Di-LS2 18um
Type of Machine: 3D AOI System
Year of Manufacture : 2023
Configuration: High-speed single-lane system, without side cameras
Technology: Highly accurate and repeatable 3D measurement technology with digital 4-way stripe projection and telecentric camera technology
Process Linking: Process linking with SAKI SPI systems
Technical Specifications:
- Resolution 18um in X/Y direction, 1um in Z direction
- Printed circuit board format 50x60mm to 500x510mm
- PCB thickness 0.6 to 5.2mm
- PCB clearance top/bottom 40/60mm
- PCB deflection +/- 2mm
- Image acquisition time: 5700 mm2/s
- 4-way projection with multidirectional ring light
- Conveyor belt height: 880 - 965 mm
- Dimensions 1040x1440x1500mm (WxHxD)
- Weight: approx. 900 kg
- Power supply ~200-240V +/-10%, 50/60Hz
- Compressed air 0.5MPa, 5l/min (ANR)
- Automatic transport width adjustment
- Operating system Windows 10
- CE conformity
Available Additional Equipment:
- Side camera option (demo system) - Four side cameras for inspecting areas of the circuit boards that the orthogonal camera cannot access
- BF2 Editor SW License - Offline programming station including software, excluding PC hardware
- BF2 Monitor SW License - Offline repair station including software, basic SPC functions
- BF2 Editor PC Hardware - Offline programming station PC hardware
- BF2 Monitor PC Hardware - Offline repair station for PC hardware
Find more here - .ucymachines/
Contact us at - sales@ucymachines
Model: 3Di-LS2 18um
Type of Machine: 3D AOI System
Year of Manufacture : 2023
Configuration: High-speed single-lane system, without side cameras
Technology: Highly accurate and repeatable 3D measurement technology with digital 4-way stripe projection and telecentric camera technology
Process Linking: Process linking with SAKI SPI systems
Technical Specifications:
- Resolution 18um in X/Y direction, 1um in Z direction
- Printed circuit board format 50x60mm to 500x510mm
- PCB thickness 0.6 to 5.2mm
- PCB clearance top/bottom 40/60mm
- PCB deflection +/- 2mm
- Image acquisition time: 5700 mm2/s
- 4-way projection with multidirectional ring light
- Conveyor belt height: 880 - 965 mm
- Dimensions 1040x1440x1500mm (WxHxD)
- Weight: approx. 900 kg
- Power supply ~200-240V +/-10%, 50/60Hz
- Compressed air 0.5MPa, 5l/min (ANR)
- Automatic transport width adjustment
- Operating system Windows 10
- CE conformity
Available Additional Equipment:
- Side camera option (demo system) - Four side cameras for inspecting areas of the circuit boards that the orthogonal camera cannot access
- BF2 Editor SW License - Offline programming station including software, excluding PC hardware
- BF2 Monitor SW License - Offline repair station including software, basic SPC functions
- BF2 Editor PC Hardware - Offline programming station PC hardware
- BF2 Monitor PC Hardware - Offline repair station for PC hardware
Find more here - .ucymachines/
Contact us at - sales@ucymachines
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