Sistema SPI VISCOM S3088 SPI

Based on the nameplate you provided and the technical data for the S3088 SPI (Solder Paste Inspection) variant, here are the key specifications for your machine:

PCs replaced in 2024 to new ones

Core Inspection Capabilities

The S3088 SPI is a specialized high-performance system designed to detect printing defects immediately after the stencil printer.

- Inspection Scope: Analyzes solder paste deposits for volume, height, form, area, displacement (X/Y offset), and smearing.
- Component Compatibility: Capable of inspecting demanding assemblies with CSPs, micro BGAs, and pad sizes down to 01005.
- 3D Technology: Uses a fringe projection process for precise 3D height and volume measurement.
- Inspection Speed: Up to 80 cm²/s (depending on resolution settings).
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Technical Specifications (from your Nameplate & U6358834 U6358834 Records)

FeatureDetailsTypeS3088 SPI (Serial No. 102688)Year of Manufacture09/2014ResolutionUp to 15 µm/pixel (lateral)Z-ResolutionTypically 0.1 µm or 0.5 µm for height measurementMax PCB Size$508\text{ mm} \times 508\text{ mm}$ (standard)Positioning UnitSynchronous linear motors for high-speed accuracyPower Consumption1.2 kW (at 230/400V)Weight700 kg

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