Ultrasonic Large Wirebonder ORTHODYNE ELECTRONICS 360C

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item-No.: 163845933 Quantity: 1 Date: 18.04.2024
Year of manufacture: 1997 Operating hours: 100 Location: 97318 Kitzingen
Price: 3,000 EUR
Manufacturer: Orthodyne Electronics
Model: 360C
Type of machine: Ultrasonic Large Wirebonder
Description: Ultrasonic Large Wirebonder Orthodyne Electronics 360C

used machine

The Model 360C Automatic Large Wire Bonder is a high-speed wire bonder for 5 to 20 mil (125 to 500 micron) wires on a variety of semiconductor and hybrid devices. The bonding head, controlled by a micro stepper motor, performs all the movements of the bonder. The range of motion is 5 inches on the X axis and +3 inches on the Y axis, 2 inches along the Z axis, and up to 200° in rotation (theta axis). The Model 360C can automatically bond up to 1,500 two-wire bonding wires in any direction onto virtually any wire-bondable electronic package. Almost all functions are programmable: pattern recognition, loop heights, stepback lengths, bond heights, gram strength, and bond time and power. A Motorola 68030 microprocessor controls all machine functions. They communicate with the control computer via a keyboard, a control panel and a data monitor. Menu-driven software guides you through the creation and execution of your wire bonding program. Programs are stored on a 290 megabyte hard drive. (Earlier M360Cs may have a hard drive with lower storage capacity.) You can easily program the Bonder for A562278 a variety of different devices. A variety of handling systems, from simple manual workpiece holders to automated indexing systems, are available. You can program the 360C for different modes of operation, including bonding a single wire, choosing from five different speeds for head movements, and stopping the head at the search position over each connection. Depending on the application, 4 mil (100 micron) thick wires can be bonded.
seller offer No. resale 163845933
Machine in stock: Yes

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